Digital processes and characterization for fabricating 3D RF devices
Abstract
In this work, co-planar waveguides (CPW) are fabricated and characterized with low temperature 3D printed materials for flexible electronic applications. Laser processing is introduced to reduce heating and cooling times for curing and subtractive manufacturing. CPWs are optimized by varying printing resolution, adjusting curing conditions and shaping conductor profile with a pico-laser. By using acrylonitrile butadiene styrene (ABS) as substrate material and Dupont CB028 as conductive material, a high S21 and low S11 CPW is fabricated. Optimized direct write methods are dispensed onto 3D complex structures to move away from 2.5D style printing and move into true 3D printed antenna devices.
Subject Area
Computer Engineering|Electrical engineering
Recommended Citation
Tsang, Harvey Hing-Cheong, "Digital processes and characterization for fabricating 3D RF devices" (2016). ETD Collection for University of Texas, El Paso. AAI10252021.
https://scholarworks.utep.edu/dissertations/AAI10252021