Size dependent melting and diffusion of silicon for microsystem applications
The size dependent reduced melting point and hydrogen enhanced surface diffusion effect on silicon nanostructures was explored experimentally. SOI and silicon wafers were patterned using nanimprint lithography and dry etching to explore the reduced melting point effect; and patterned with photolithography and dry etching to explore the hydrogen enhanced surface diffusion. The nanotextured samples were annealed in a wide variety of furnaces with nitrogen, forming gas, and argon atmospheres. Nitrogen was found to block the reshaping effect while argon was found to cause extensive pitting damage in the setup used. Micropatterned samples were annealed in a low pressure hydrogen enabled tube furnace with nitrogen, hydrogen, and mixture atmospheres. Lastly, a custom heating chamber was proposed to address the issues that were demonstrated in other annealing configurations.
Computer Engineering|Electrical engineering
Marquez Arciba, Noel Felipe, "Size dependent melting and diffusion of silicon for microsystem applications" (2011). ETD Collection for University of Texas, El Paso. AAI1494363.